Intel, Odisha explore chip packaging facility

IANS | June 1, 2026 1:57 AM

Washington, June 1 (IANS) Intel Corporation and 3D Glass Solutions have signed a memorandum of understanding with the Odisha government to explore establishing an advanced semiconductor glass core packaging substrate manufacturing facility, a move that could strengthen India's ambitions to become a global semiconductor hub.

India, US discuss defence cooperation and advancing strategic interests in Indo-Pacific

IANS | May 31, 2026 11:03 PM

Singapore, May 31 (IANS) Defence Secretary Rajesh Kumar Singh held a meeting with House Armed Services Committee Member Pat Harrigan, who led a bipartisan US Congressional Delegation (CODEL), in Singapore on Sunday, with discussions held on regional security, expanding defence cooperation, and advancing shared strategic interests in the Indo-Pacific.

India-Oman free trade pact to kick in on Monday

IANS | May 31, 2026 9:14 PM

New Delhi, May 31 (IANS) India-Oman Comprehensive Economic Partnership Agreement (CEPA) offering zero duty access to a range of Indian labour-intensive exports, will kick in from Monday.