Odisha govt signs semiconductor substrate manufacturing pact with Intel, 3DGS: Ashwini Vaishnaw
New Delhi, May 29 (IANS) The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India, according to Union Minister for Electronics and Information Technology Ashwini Vaishnaw on Friday.