Intel, Odisha explore chip packaging facility

IANS | June 1, 2026 1:57 AM

Washington, June 1 (IANS) Intel Corporation and 3D Glass Solutions have signed a memorandum of understanding with the Odisha government to explore establishing an advanced semiconductor glass core packaging substrate manufacturing facility, a move that could strengthen India's ambitions to become a global semiconductor hub.

India, US discuss defence cooperation and advancing strategic interests in Indo-Pacific

IANS | May 31, 2026 11:03 PM

Singapore, May 31 (IANS) Defence Secretary Rajesh Kumar Singh held a meeting with House Armed Services Committee Member Pat Harrigan, who led a bipartisan US Congressional Delegation (CODEL), in Singapore on Sunday, with discussions held on regional security, expanding defence cooperation, and advancing shared strategic interests in the Indo-Pacific.

Catholic bishops meet Pope Leo, highlight challenges faced by Christians in Pakistan

IANS | May 31, 2026 10:43 PM

Islamabad, May 31 (IANS) Catholic bishops, comprising three archbishops, four bishops, and a cardinal, from Pakistan visited the Vatican to submit their reports in different departments and meet Pope Leo XIV. Catholic Bishops' Conference of Pakistan President Bishop Samson Shukardin of Hyderabad, highlighted the challenges faced by Christians in Pakistan, a report has said.